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! Note ? Please read rating and ! CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
? This catalog has only typical speci?cations because there is no space for detailed speci?cations. Therefore, please review our product speci?cations or consult the approval sheet for product speci?cations before ordering.
Ceramic Discriminators Notice
c CDBKB Series Notice (Soldering and Mounting)
1. Standard Reflow Soldering Conditions
(1) Reflow
Filter is soldered twice within the following temperature
P05E.pdf
Nov.24,2011
conditions.
260
Peak
(260°C max.)
230
Heating
(230°C)
100
Pre-heating
(150-180°C)
Gradual
Cooling
30 sec.
min.
60-120 sec.
40 sec.
max.
120 sec.
min.
(2) Soldering Iron
Electrode is directly soldered with the tip of soldering iron
at +350±5°C for 3.0±0.5 seconds.
2. Wash
(1) Cleaning Solvent
CFC alternatives (HCFC Series), Isopropyl Alcohol (IPA),
Water (Demineralized Water), Cleaning Water Solution
(Cleanthrough-750H, Pine Alpha 100S), Silicon
(Technocare FRW)
(2) Cleaning Conditions
o Immersion Wash
2 minutes max. in above solvent at +60°C max.
o Shower or Rinse Wash
2 minutes max. in above solvent at +60°C max.
(3) Notice
o When components are immersed in solvent, be sure to
maintain the temperature of components below the
temperature of solvent.
o Please do not use ultrasonic cleaning.
o Total washing time should be within 4 minutes.
o Please ensure the component is thoroughly evaluated
in your application circuit.
o Please do not use chlorine, petroleum or alkaline
cleaning solvents.
o If you plan to use any other type of solvents, please
consult with Murata or Murata representative prior to
using.
c CDBKB Series Notice (Handling)
1. The component will be damaged when an excessive
stress is applied.
2. If the component is cleaned, please con?rm
that the reliability has not been degraded.
3. In case of covering ?lter with over coating,
conditions such as material of resin, cure
temperature, and so on should be evaluated
carefully.
5. The product, packed in a moisture-proof bag (dry
pack), is sensitive to moisture.
The following treatment is required before
applying re?ow soldering, to avoid package
cracks or reliability degradation caused by
thermal stress. When unpacked, store the component
in an atmosphere of below 25 degrees C. and below
65%R.H., and solder within 48 hours.
4. Do not use strong acidity ?ux, more than 0.2wt%
chlorine content, in re?ow soldering.
Continued on the following page.
70
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